10AX115U3F45E2LG vs 10AX115U3F45E2SG Perbandingan

Perbandingan bersamaan detil 10AX115U3F45E2LG dari Intel dan 10AX115U3F45E2SG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10AX115U3F45E2LG 10AX115U3F45E2SG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Arria 10 GX —
Family Arria 10 Arria 10 GX
Logic Elements 1,150,000 —
Embedded Memory Bits 68,857,856 68,857,856 (≈ 52.99 Mbit)
User I/O Count 480 —
Speed Grade U3 (medium-performance, transceiver-focused) -2 (E2 commercial/extended)
Package Code F45 (45 × 45 mm FCBGA) —
Package Type 1932-ball FCBGA (Flip-Chip BGA) —
Process Technology 20 nm TSMC —
Transceiver Data Rate Up to 28.05 Gbps —
DSP Blocks Variable-precision, 1.5 TFLOPs FP32 Variable-precision, hardened floating-point
PCIe Hard IP Gen3 x8/x16 —
Memory Interfaces DDR4, DDR3, QDR IV, RLDRAM 3 —
Suhu Kerja 0C to +100C (Industrial, E2 grade) Industrial (junction -40 °C to +100 °C) – device grade U
Tipe Mounting Surface Mount (BGA) —
Configuration Method SRAM-based, loaded via JTAG / AS / PS FPGA configuration via serial/parallel flash, JTAG
Status RoHS Compliant —
Lead-Free / Halogen-Free Yes / Yes —
Logic Elements (LE) — 1,150,000
Adaptive Logic Modules (ALM) — 427,200
Number of Transceivers — [DATA_NEEDED: per-die transceiver count, F45 package variant]
Maximum Transceiver Data Rate — 17.4 Gbps
Hard Memory Controllers — 2 (DDR4/DDR3/QDRII+/RLDRAM3)
Hard PCIe Gen3 IP Blocks — 2 × PCIe Gen3 (x8/x4/x2/x1)
Paket — 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch)
Process Node — 20 nm Tri-Gate (Intel)
Supply Voltage Core — [DATA_NEEDED: VCC/VCCP core voltage]
RoHS Compliance — Compliant
Level MSL — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]

Spek dan Sumber

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