10M02DCU324I7G vs 10M02DCU324A7G Perbandingan

Perbandingan bersamaan detil 10M02DCU324I7G dari Intel dan 10M02DCU324A7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10M02DCU324I7G 10M02DCU324A7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX 10 MAX 10
Logic Elements (LEs) 2,000 —
Embedded Memory (M9K blocks) 16 —
Embedded Memory (bits) 110,592 —
Embedded Multipliers (18x18) 16 —
User I/O Count 160 160
User I/O Banks 8 —
Paket 324-ball UBGA (U324) —
Pin/Pitch 324 balls / 0.8 mm pitch —
Process Node 55 nm —
Configuration Memory On-chip dual-boot flash —
Core Voltage (VCCINT) 1.2 V —
Analog Block 12-bit SAR ADC with temperature sensor —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
Status RoHS Compliant Compliant
Logic Elements (LE) — 2,000
Embedded Memory — 110,592 bits
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Core Voltage — 1.15 V to 1.25 V
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Suhu Hubung Kerja — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Tipe Mounting — Surface Mount
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

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