10M02DCU324I7G vs 10M02DCU324A7G 比較

詳細並排比較 10M02DCU324I7G 由 Intel 與 10M02DCU324A7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 10M02DCU324I7G 10M02DCU324A7G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 MAX 10
Logic Elements (LEs) 2,000 —
Embedded Memory (M9K blocks) 16 —
Embedded Memory (bits) 110,592 —
Embedded Multipliers (18x18) 16 —
User I/O Count 160 160
User I/O Banks 8 —
封裝 324-ball UBGA (U324) —
Pin/Pitch 324 balls / 0.8 mm pitch —
Process Node 55 nm —
Configuration Memory On-chip dual-boot flash —
Core Voltage (VCCINT) 1.2 V —
Analog Block 12-bit SAR ADC with temperature sensor —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
RoHS 狀態 Compliant Compliant
Logic Elements (LE) — 2,000
Embedded Memory — 110,592 bits
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Core Voltage — 1.15 V to 1.25 V
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
工作接面溫度 — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
安裝類型 — Surface Mount
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

資料表與資源

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