10M02DCU324I7G vs 10M02DCU324A7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M02DCU324I7G sa pamamagitan ng Intel at 10M02DCU324A7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10M02DCU324I7G 10M02DCU324A7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX 10 MAX 10
Logic Elements (LEs) 2,000 —
Embedded Memory (M9K blocks) 16 —
Embedded Memory (bits) 110,592 —
Embedded Multipliers (18x18) 16 —
User I/O Count 160 160
User I/O Banks 8 —
Packhaging 324-ball UBGA (U324) —
Pin/Pitch 324 balls / 0.8 mm pitch —
Process Node 55 nm —
Configuration Memory On-chip dual-boot flash —
Core Voltage (VCCINT) 1.2 V —
Analog Block 12-bit SAR ADC with temperature sensor —
Operating Temperature (Industrial) -40C to +100C (I7 grade) —
Tindminan RoHS Compliant Compliant
Logic Elements (LE) — 2,000
Embedded Memory — 110,592 bits
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
User Flash Memory — Integrated (on-chip flash configuration)
Integrated ADC — 12-bit, 1 Msps+, successive approximation
Core Voltage — 1.15 V to 1.25 V
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Temperature ng Junction na Operasyon — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Uri ng Pagpapasok — Surface Mount
Process Technology — 55 nm embedded flash (TSMC)
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

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