10M04SCM153I7G vs 10M04SAM153I7G Perbandingan
Perbandingan bersamaan detil 10M04SCM153I7G dari Intel dan 10M04SAM153I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M04SCM153I7G | 10M04SAM153I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | 193,536 |
| Maximum User I/O | 112 | — |
| Paket | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Process Technology | 55 nm | 55 nm (embedded flash, TSMC) |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Embedded Memory Type | M9K (9 Kbit blocks) | — |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) | — |
| DSP Blocks (18x18 Multipliers) | 16 | — |
| PLLs | 2 | [DATA_NEEDED: PLL count] |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs | — |
| Speed Grade | SC (commercial/industrial slow) | — |
| Temperature Grade | Industrial (I), -40C to +100C | — |
| Configuration Method | On-chip flash + JTAG | On-die flash, instant-on |
| Lead-free / RoHS | Yes (7G suffix) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| User I/O Count | — | 112 |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Suhu Kerja | — | -40 °C to +100 °C (industrial) |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| ADC Block | — | [DATA_NEEDED: ADC presence on this density] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |