10M04SCM153I7G vs 10M04SAM153I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M04SCM153I7G disebabkan oleh Intel dan 10M04SAM153I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M04SCM153I7G | 10M04SAM153I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | 193,536 |
| Maximum User I/O | 112 | — |
| Kemasan | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Process Technology | 55 nm | 55 nm (embedded flash, TSMC) |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Embedded Memory Type | M9K (9 Kbit blocks) | — |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) | — |
| DSP Blocks (18x18 Multipliers) | 16 | — |
| PLLs | 2 | [DATA_NEEDED: PLL count] |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs | — |
| Speed Grade | SC (commercial/industrial slow) | — |
| Temperature Grade | Industrial (I), -40C to +100C | — |
| Configuration Method | On-chip flash + JTAG | On-die flash, instant-on |
| Lead-free / RoHS | Yes (7G suffix) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| User I/O Count | — | 112 |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| Suhu Operasi | — | -40 °C to +100 °C (industrial) |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| ADC Block | — | [DATA_NEEDED: ADC presence on this density] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |