10M04SCM153I7G vs 10M04SAM153I7G 比較
詳細並排比較 10M04SCM153I7G 由 Intel 與 10M04SAM153I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M04SCM153I7G | 10M04SAM153I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX® 10 FPGA |
| Logic Elements (LE) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | 193,536 |
| Maximum User I/O | 112 | — |
| 封裝 | 153-ball MBGA (Micro FineLine BGA), 8x8 mm, 0.5 mm pitch | 153-ball MBGA (Micro FineLine BGA) |
| Process Technology | 55 nm | 55 nm (embedded flash, TSMC) |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVCMOS 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Embedded Memory Type | M9K (9 Kbit blocks) | — |
| User Flash (CFM/UFM) | Available (configurable flash + user flash) | — |
| DSP Blocks (18x18 Multipliers) | 16 | — |
| PLLs | 2 | [DATA_NEEDED: PLL count] |
| On-chip ADC | 12-bit, 1 Msps, up to 17 analog inputs | — |
| Speed Grade | SC (commercial/industrial slow) | — |
| Temperature Grade | Industrial (I), -40C to +100C | — |
| Configuration Method | On-chip flash + JTAG | On-die flash, instant-on |
| Lead-free / RoHS | Yes (7G suffix) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Series | — | MAX 10 (10M04) |
| Logic Elements (LEs) | — | 4,000 |
| User I/O Count | — | 112 |
| I/O Voltage Support | — | 3.0 V / 3.3 V LVCMOS |
| Package Pitch | — | [DATA_NEEDED: package ball pitch] |
| 工作溫度 | — | -40 °C to +100 °C (industrial) |
| Multiplier Blocks (18×18) | — | [DATA_NEEDED: multiplier count] |
| ADC Block | — | [DATA_NEEDED: ADC presence on this density] |
| User Flash | — | [DATA_NEEDED: user flash size] |
| RoHS 狀態 | — | Compliant |
| Lead-Free | — | Yes |