10M25DAF484A7G vs 10M25DAF484C8G Perbandingan
Perbandingan bersamaan detil 10M25DAF484A7G dari Intel dan 10M25DAF484C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF484A7G | 10M25DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Paket | 484-ball BGA | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Suhu Kerja | -40C to +125C (automotive) | 0 °C to 85 °C (Commercial) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip dual-configuration flash |
| PLLs | 8 | Yes (up to 4 analog PLLs per device) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | — |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Speed Grade | — | -8 |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Level MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |