10M25DAF484A7G vs 10M25DAF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484A7G sa pamamagitan ng Intel at 10M25DAF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF484A7G | 10M25DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 | 25,000 |
| Embedded Memory (bits) | 691,200 | — |
| Embedded Memory Blocks | 360 (M9K) | — |
| 18x18 Multipliers | 25 | — |
| User I/O Pins | 360 | — |
| Packhaging | 484-ball BGA | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Temperature na Operasyon | -40C to +125C (automotive) | 0 °C to 85 °C (Commercial) |
| Configuration Memory | On-chip flash (non-volatile) | On-chip dual-configuration flash |
| PLLs | 8 | Yes (up to 4 analog PLLs per device) |
| Global Clock Networks | 16 | — |
| On-chip ADC | 12-bit SAR, 16 channels, up to 1 Msps | — |
| Hard Memory Controller | DDR3 / LPDDR3 | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 2.5 V / 3.3 V (bank-dependent) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Speed Grade | — | -8 |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Level ng MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |