10M50DAF484I7G vs 10M50DAF256I7G Perbandingan
Perbandingan bersamaan detil 10M50DAF484I7G dari Intel dan 10M50DAF256I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF484I7G | 10M50DAF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Paket | 484-ball FBGA (F484) | 256-LBGA (17 mm x 17 mm) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit SAR, up to 17 analog inputs |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Configuration Mode | Single-chip (no external boot device required) | Internal flash (instant-on) |
| Tipe Mounting | Surface Mount (FBGA) | Surface Mount (BGA) |
| Level MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Core Voltage | — | 1.2 V |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |