10M50DAF484I7G vs 10M50DAF256I7G 比較
詳細並排比較 10M50DAF484I7G 由 Intel 與 10M50DAF256I7G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | 10M50DAF484I7G | 10M50DAF256I7G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| 封裝 | 484-ball FBGA (F484) | 256-LBGA (17 mm x 17 mm) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit SAR, up to 17 analog inputs |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Configuration Mode | Single-chip (no external boot device required) | Internal flash (instant-on) |
| 安裝類型 | Surface Mount (FBGA) | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Core Voltage | — | 1.2 V |
| 工作溫度 | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |