10M50DAF484I7G vs 10M50DAF256I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7G disebabkan oleh Intel dan 10M50DAF256I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484I7G | 10M50DAF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Kemasan | 484-ball FBGA (F484) | 256-LBGA (17 mm x 17 mm) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit SAR, up to 17 analog inputs |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Configuration Mode | Single-chip (no external boot device required) | Internal flash (instant-on) |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount (BGA) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Core Voltage | — | 1.2 V |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |