10M50DAF484I7G vs 10M50DAF256I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF484I7G sa pamamagitan ng Intel at 10M50DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10M50DAF484I7G 10M50DAF256I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX 10 MAX 10
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 —
Embedded User Flash (bits) 1,677,312 (dual configuration) —
User I/O Count 360 —
Packhaging 484-ball FBGA (F484) 256-LBGA (17 mm x 17 mm)
Package Pitch 1.0 mm —
Package Body Size 23 x 23 mm —
Process Technology TSMC 55 nm TSMC 55 nm embedded flash
Supply Voltage - Core 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
On-die Configuration Flash Yes (dual-boot) —
Integrated ADC 12-bit, 1 MSPS, up to 18 channels 12-bit SAR, up to 17 analog inputs
DSP Blocks 144 (18x18 multipliers) —
PLLs 4 On-chip (4 typical for 10M50 family)
Configuration Mode Single-chip (no external boot device required) Internal flash (instant-on)
Uri ng Pagpapasok Surface Mount (FBGA) Surface Mount (BGA)
Level ng MSL 3 (per JEDEC J-STD-020) —
Tindminan RoHS Compliant Compliant
Lead-free / Halogen-free Yes / Yes —
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Core Voltage — 1.2 V
Temperature na Operasyon — -40C to +100C (Industrial)
Tray Quantity — 90 per tray (typical for 256-BGA)

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