10M50DAF484I7G vs 10M50DAF256I7G Karşılaştırma
Ayrıntılı yan yana karşılaştırma 10M50DAF484I7G tarafından Intel ve 10M50DAF256I7G tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | 10M50DAF484I7G | 10M50DAF256I7G |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded User Flash (bits) | 1,677,312 (dual configuration) | — |
| User I/O Count | 360 | — |
| Paket | 484-ball FBGA (F484) | 256-LBGA (17 mm x 17 mm) |
| Package Pitch | 1.0 mm | — |
| Package Body Size | 23 x 23 mm | — |
| Process Technology | TSMC 55 nm | TSMC 55 nm embedded flash |
| Supply Voltage - Core | 1.2 V | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| On-die Configuration Flash | Yes (dual-boot) | — |
| Integrated ADC | 12-bit, 1 MSPS, up to 18 channels | 12-bit SAR, up to 17 analog inputs |
| DSP Blocks | 144 (18x18 multipliers) | — |
| PLLs | 4 | On-chip (4 typical for 10M50 family) |
| Configuration Mode | Single-chip (no external boot device required) | Internal flash (instant-on) |
| Montaj Türü | Surface Mount (FBGA) | Surface Mount (BGA) |
| MSL Seviyesi | 3 (per JEDEC J-STD-020) | — |
| RoHS Durumu | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Core Voltage | — | 1.2 V |
| İşletim Sıcaklığı | — | -40C to +100C (Industrial) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |