10M50DAF484I7P vs 10M50DAF484C7G Perbandingan
Perbandingan bersamaan detil 10M50DAF484I7P dari Intel dan 10M50DAF484C7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF484I7P | 10M50DAF484C7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Paket | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 2 |
| Global Clock Networks | 20 | [DATA_NEEDED: global clocks count] |
| Speed Grade | 7 (slowest industrial bin, highest margin) | — |
| Suhu Kerja | -40C to +100C (Tj, industrial) | 0 C to +85 C (commercial grade, C7 speed) |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Status RoHS | Compliant | Compliant |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | MAX 10 |
| Logic Elements | — | 50,000 |
| Embedded Memory | — | 1,677,312 bits (approximately 1.6 Mbit) |
| Embedded 18x18 Multipliers | — | 312 |
| User Flash Memory | — | [DATA_NEEDED: user flash bits] |
| Number of User I/O | — | 360 |
| Tegangan Pemuat | — | 1.2 V core (VCCINT) |
| Tipe Mounting | — | Surface Mount |
| Configuration Memory | — | Non-volatile embedded flash (dual-configuration) |
| ADC | — | Integrated 12-bit SAR, up to 17 channels |
| Process Technology | — | 55 nm embedded flash CMOS |
| Level MSL | — | 3 |