10M50DAF484I7P vs 10M50DAF484C7G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7P disebabkan oleh Intel dan 10M50DAF484C7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10M50DAF484I7P 10M50DAF484C7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Product Family MAX 10 —
Logic Elements (LE) 50,000 —
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Kemasan 484-ball FineLine BGA (F484) 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) 2
Global Clock Networks 20 [DATA_NEEDED: global clocks count]
Speed Grade 7 (slowest industrial bin, highest margin) —
Suhu Operasi -40C to +100C (Tj, industrial) 0 C to +85 C (commercial grade, C7 speed)
Configuration Modes Internal flash, JTAG, dual-boot image support —
Status RoHS Compliant Compliant
Product Type — FPGA (Field-Programmable Gate Array)
Series — MAX 10
Logic Elements — 50,000
Embedded Memory — 1,677,312 bits (approximately 1.6 Mbit)
Embedded 18x18 Multipliers — 312
User Flash Memory — [DATA_NEEDED: user flash bits]
Number of User I/O — 360
Tegangan Pemberi Arus — 1.2 V core (VCCINT)
Jenis Pemasangan — Surface Mount
Configuration Memory — Non-volatile embedded flash (dual-configuration)
ADC — Integrated 12-bit SAR, up to 17 channels
Process Technology — 55 nm embedded flash CMOS
Aras MSL — 3

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