10M50DAF484I7P vs 10M50DCF484I7G Perbandingan
Perbandingan bersamaan detil 10M50DAF484I7P dari Intel dan 10M50DCF484I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DAF484I7P | 10M50DCF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | — |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Paket | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | 4 |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | 7 (fastest commercial/industrial) |
| Suhu Kerja | -40C to +100C (Tj, industrial) | — |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Logic Elements | — | 50,000 |
| Embedded SRAM | — | 1,677,312 bits (1.6 Mb) |
| User Flash Memory | — | Up to 5,888 Kb (on-chip dual configuration) |
| Maximum User I/O Pins | — | 360 |
| LVDS Channels (dedicated) | — | 160 (rx + tx) |
| 18x18 Hardware Multipliers | — | 144 |
| Core Voltage | — | 1.2 V (internal) |
| Process Technology | — | TSMC 55 nm embedded flash |
| Suhu Hubung Kerja | — | -40C to +100C (industrial, 'I' suffix) |
| Configuration Mode | — | On-chip flash + JTAG |
| Integrated ADC | — | 12-bit, up to 17 channels, 1 MSPS |
| Tipe Mounting | — | Surface Mount (BGA) |