10M50DCF484I7G vs 10M50DAF484I7G Perbandingan
Perbandingan bersamaan detil 10M50DCF484I7G dari Intel dan 10M50DAF484I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M50DCF484I7G | 10M50DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 50,000 | — |
| Embedded SRAM | 1,677,312 bits (1.6 Mb) | — |
| User Flash Memory | Up to 5,888 Kb (on-chip dual configuration) | — |
| Maximum User I/O Pins | 360 | — |
| LVDS Channels (dedicated) | 160 (rx + tx) | — |
| PLLs | 4 | 4 |
| 18x18 Hardware Multipliers | 144 | — |
| Paket | 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal) | — |
| Process Technology | TSMC 55 nm embedded flash | TSMC 55 nm |
| Suhu Hubung Kerja | -40C to +100C (industrial, 'I' suffix) | — |
| Speed Grade | 7 (fastest commercial/industrial) | — |
| Configuration Mode | On-chip flash + JTAG | Single-chip (no external boot device required) |
| Integrated ADC | 12-bit, up to 17 channels, 1 MSPS | 12-bit, 1 MSPS, up to 18 channels |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (FBGA) |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |