EP2AGX45DF29I3N vs EP2AGX45DF29I3NAD Perbandingan
Perbandingan bersamaan detil EP2AGX45DF29I3N dari Intel dan EP2AGX45DF29I3NAD dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP2AGX45DF29I3N - Arria II GX FPGA 42K LE 364 I/O | Intel
EP2AGX45DF29I3N ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EP2AGX45DF29I3N | EP2AGX45DF29I3NAD |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | — |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Suhu Kerja | -40 C to +100 C (industrial) | — |
| Speed Grade | I3 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Transceivers | Up to 8 channels, 3.125 Gbps | Multi-gigabit transceivers integrated |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Paket | 780-ball FC-FBGA (DF29) | 780-ball FBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |