EP2AGZ350FH29C3G vs EP2AGZ350FH29I3G Perbandingan

Perbandingan bersamaan detil EP2AGZ350FH29C3G dari Intel dan EP2AGZ350FH29I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2AGZ350FH29C3G EP2AGZ350FH29I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Logic Elements 350,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (Bits) 16,402,944 —
Embedded Memory Blocks [DATA_NEEDED: M9K/M144K block count] —
User I/O Pins 281 —
Transceivers 24 channels Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet)
Transceiver Data Rate (max) 8.5 Gbps —
PCI Express Hard IP 4 x PCIe Gen2 (x1/x4) —
External Memory Interface DDR3 up to 800 MHz, DDR2, QDRII+ —
PLLs 8 (4 enhanced, 4 fast) —
Global Clocks 16 —
Process Node 40 nm TSMC 40 nm
Speed Grade C3 (commercial, slowest) —
Suhu Hubung Kerja 0C to +85C —
Paket 780-ball FBGA (HBGA, 29x29 mm) 780-FBGA (FineLine BGA, FH29)
Tipe Mounting Surface Mount Surface Mount
Status RoHS Compliant Compliant
Lead-Free Yes —
Level MSL [DATA_NEEDED: MSL rating] 3 (per BGA package handling guidelines)
Family — Arria II GZ
Logic Elements (LE) — 350000 (approximately)
User I/O Count — 281
Temperature Grade — Industrial (-40C to +100C)
Rentang Suhu Kerja — -40C to +100C
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Memory Interface — DDR3 with read/write leveling support (family feature)
Embedded Multipliers — 18x18 hardware multipliers (family feature)
Configuration Method — Serial or parallel via Quartus II (family feature)
Lead Free — Yes
Bebas Halogen — [DATA_NEEDED: halogen free status]

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