EP2AGZ350HF40C3N vs EP2AGZ225HF40C3N Perbandingan
Perbandingan bersamaan detil EP2AGZ350HF40C3N dari Intel dan EP2AGZ225HF40C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2AGZ350HF40C3N | EP2AGZ225HF40C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 224000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 8960 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Process Technology | 40 nm low-power | — |
| Paket | 1517-ball FCBGA (HF40) | — |
| Operating Temperature Grade | Commercial (C3) | Industrial |
| Configuration Mode | FPP / AS / JTAG | — |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| User I/O Pins | — | 734 |
| Jumlah Pin | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Level MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Process Node | — | 40 nm |
| Status RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |