EP2AGZ350HF40C3N vs EP2AGZ225HF40C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C3N sa pamamagitan ng Intel at EP2AGZ225HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGZ225HF40C3N - Arria II GZ 224K LE FPGA, 734 I/O | Intel FPGA
EP2AGZ225HF40C3N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGZ350HF40C3N | EP2AGZ225HF40C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 224000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 8960 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Process Technology | 40 nm low-power | — |
| Packhaging | 1517-ball FCBGA (HF40) | — |
| Operating Temperature Grade | Commercial (C3) | Industrial |
| Configuration Mode | FPP / AS / JTAG | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| User I/O Pins | — | 734 |
| Bilang ng Pins | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| Level ng MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Process Node | — | 40 nm |
| Tindminan RoHS | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |