EP2AGZ350HF40C3N vs EP2AGZ225HF40C3N 比較
詳細並排比較 EP2AGZ350HF40C3N 由 Intel 與 EP2AGZ225HF40C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGZ350HF40C3N | EP2AGZ225HF40C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 348,500 | 224000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Logic Array Blocks (LABs) | 13,940 | 8960 |
| Embedded Memory Bits | 21,270,528 | — |
| Embedded Memory Blocks (M9K) | [DATA_NEEDED: M9K count] | — |
| User I/Os | 734 | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| Transceivers | Up to 24 (per family datasheet) | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate | Up to 6.553 Gbps | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: core voltage] |
| Process Technology | 40 nm low-power | — |
| 封裝 | 1517-ball FCBGA (HF40) | — |
| Operating Temperature Grade | Commercial (C3) | Industrial |
| Configuration Mode | FPP / AS / JTAG | — |
| 安裝類型 | Surface Mount (flip-chip BGA) | Surface Mount |
| Embedded Memory (bits) | — | 14248960 |
| User I/O Pins | — | 734 |
| 腳位數 | — | 1517 |
| Package Type | — | 1517-BBGA, FCBGA (HF40) |
| MSL 等級 | — | 3 (168 Hours) |
| Packaging | — | Tray |
| Process Node | — | 40 nm |
| RoHS 狀態 | — | [DATA_NEEDED: rohs status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |