EP2SGX30DF780I7N vs EP2SGX30DF780I3N Perbandingan
Perbandingan bersamaan detil EP2SGX30DF780I7N dari Intel dan EP2SGX30DF780I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30DF780I7N | EP2SGX30DF780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix II GX | — |
| Family | Stratix II GX (Enhanced Configuration / EPC) | Stratix II GX |
| Logic Elements | 33,880 LEs | 33,880 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (bits) | 1,369,728 bits | — |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| Maximum User I/O | 586 user I/O pins | — |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps | — |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE | — |
| Paket | 780-ball FineLine BGA | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Core Voltage | 1.2 V (typical) | — |
| Process Technology | 90 nm | 90 nm CMOS |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Speed Grade | 7 (fastest commercial speed grade) | I3 |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Cells | — | 33,380 |
| Configurable Logic Blocks (CLBs) | — | 33,880 |
| Total Memory Bits | — | 1,369,728 |
| Maximum Core Frequency | — | 622.08 MHz |
| Core Supply Voltage | — | 1.2 V |
| User I/O Pins | — | 361 |
| Operating Temperature Grade | — | Industrial |
| Lead Free | — | Yes |