EP2SGX60EF1152I3 vs EP2SGX60EF1152I3N Perbandingan

Perbandingan bersamaan detil EP2SGX60EF1152I3 dari Intel dan EP2SGX60EF1152I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX60EF1152I3 EP2SGX60EF1152I3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family Stratix II GX Stratix II GX
Series EP2SGX60 —
Logic Elements (LEs) 60,440 60,440
Adaptive Logic Modules (ALMs) 30,220 (estimated from LEs) —
Equivalent Logic Cells (CLBs) 60,440 —
Embedded Memory (Bits) 2,544,192 bits (per DigiKey listing for the I4N variant) —
Maximum Internal Frequency 717 MHz —
Combinational Delay (per CLB) 2.99 ns —
Multi-Gigabit Transceivers [DATA_NEEDED: exact count for EP2SGX60] —
Maximum Transceiver Data Rate 6.375 Gbps (per Stratix II GX family spec) —
Total RAM Bits 2,544,192 bits —
Paket 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch —
Pin/Ball Count 1152 —
Tipe Mounting Surface Mount (BGA) Surface Mount (BGA)
Suhu Kerja -40C to +100C (Industrial, I3 speed grade) —
Speed Grade I3 (Industrial) —
Configuration Mode Enhanced (EPC) - fast parallel via external memory —
Process Technology 90 nm CMOS 90 nm
Status RoHS [DATA_NEEDED: not in retrieved snippets] Compliant
Device Type — Field-Programmable Gate Array (FPGA)
Configurable Logic Blocks (CLBs) — 60,440
Embedded Memory Bits — 2,544,192 bits
Internal Frequency (max) — 717 MHz
Core Voltage — 1.2 V
Package Type — 1152-ball FC-FBGA
Package Size — 35 x 35 mm (1 mm ball pitch)
Number of Terminals — 1152
Terminal Form — Ball
Temperature Grade — Industrial (-40C to +100C junction)
Lead-Free — Yes
Level MSL — [DATA_NEEDED: MSL level]

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