EP2SGX60EF1152I3 vs EP2SGX60EF1152I3N 比較
詳細並排比較 EP2SGX60EF1152I3 由 Intel 與 EP2SGX60EF1152I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
EP2SGX60EF1152I3 Obsolete
規格比較
| 參數 | EP2SGX60EF1152I3 | EP2SGX60EF1152I3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX60 | — |
| Logic Elements (LEs) | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 (estimated from LEs) | — |
| Equivalent Logic Cells (CLBs) | 60,440 | — |
| Embedded Memory (Bits) | 2,544,192 bits (per DigiKey listing for the I4N variant) | — |
| Maximum Internal Frequency | 717 MHz | — |
| Combinational Delay (per CLB) | 2.99 ns | — |
| Multi-Gigabit Transceivers | [DATA_NEEDED: exact count for EP2SGX60] | — |
| Maximum Transceiver Data Rate | 6.375 Gbps (per Stratix II GX family spec) | — |
| Total RAM Bits | 2,544,192 bits | — |
| 封裝 | 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch | — |
| Pin/Ball Count | 1152 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (BGA) |
| 工作溫度 | -40C to +100C (Industrial, I3 speed grade) | — |
| Speed Grade | I3 (Industrial) | — |
| Configuration Mode | Enhanced (EPC) - fast parallel via external memory | — |
| Process Technology | 90 nm CMOS | 90 nm |
| RoHS 狀態 | [DATA_NEEDED: not in retrieved snippets] | Compliant |
| Device Type | — | Field-Programmable Gate Array (FPGA) |
| Configurable Logic Blocks (CLBs) | — | 60,440 |
| Embedded Memory Bits | — | 2,544,192 bits |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Type | — | 1152-ball FC-FBGA |
| Package Size | — | 35 x 35 mm (1 mm ball pitch) |
| Number of Terminals | — | 1152 |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial (-40C to +100C junction) |
| Lead-Free | — | Yes |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |