EP3C25F324I7N vs EP3C25F324I7 Perbandingan
Perbandingan bersamaan detil EP3C25F324I7N dari Intel dan EP3C25F324I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3C25F324I7N | EP3C25F324I7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Embedded Memory | 608,256 bits (66 M9K blocks of 9 Kbits each) | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | 66 | 66 |
| Maximum User I/O Pins | 215 | — |
| LVDS Pairs | 66 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| I/O Bank Voltage Range | 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) | — |
| Paket | 324-ball FBGA (Fine-Pitch BGA) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) | Passive Serial (PS), Active Serial (AS), JTAG |
| Speed Grade | 7 (slower speed grade, lower power) | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level MSL | 3 (168 hours) | — |
| Series | — | Cyclone III |
| Logic Array Blocks (LABs) | — | 1,539 |
| Maximum User I/O | — | 215 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Suhu Hubung Kerja | — | -40 °C to +100 °C (industrial) |
| Tipe Mounting | — | Surface Mount |