EP3C25F324I7N vs EP3C25F324I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324I7N sa pamamagitan ng Intel at EP3C25F324I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C25F324I7N EP3C25F324I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Cyclone III —
Logic Elements (LEs) 24,624 24,624
Embedded Memory 608,256 bits (66 M9K blocks of 9 Kbits each) 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers 66 66
Maximum User I/O Pins 215 —
LVDS Pairs 66 —
PLLs 4 4
Global Clock Networks 20 20
Process Technology 65 nm TSMC 65 nm low-power CMOS
Core Voltage 1.2 V —
I/O Bank Voltage Range 1.2 V to 3.3 V (LVCMOS, LVTTL, LVDS, SSTL, HSTL) —
Packhaging 324-ball FBGA (Fine-Pitch BGA) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Temperature na Operasyon -40C to +100C (Industrial) —
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG, Fast Passive Parallel (FPP) Passive Serial (PS), Active Serial (AS), JTAG
Speed Grade 7 (slower speed grade, lower power) —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL 3 (168 hours) —
Series — Cyclone III
Logic Array Blocks (LABs) — 1,539
Maximum User I/O — 215
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
Temperature ng Junction na Operasyon — -40 °C to +100 °C (industrial)
Uri ng Pagpapasok — Surface Mount

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