EP3SE110F1152I4L vs EP3SE110F1152C3N Perbandingan

Perbandingan bersamaan detil EP3SE110F1152I4L dari Intel dan EP3SE110F1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE110F1152I4L EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Waktu Pembelian Terakhir
Series Stratix III E Stratix III
Logic Elements 107,500 —
Embedded Memory Bits 8,936,448 bits —
User I/O Count 744 —
Number of LABs/CLBs 4300 —
DSP Multipliers 528 (9-bit equivalent) —
Paket 1152-BBGA, FCBGA —
Tipe Mounting Surface Mount Surface Mount
Suhu Kerja -40C to +100C (Industrial) 0 °C to 85 °C (commercial)
Speed Grade I4 (fastest industrial grade) C3
Process Technology 40 nm 65 nm TSMC
Supply Voltage (Core) [DATA_NEEDED: nominal core voltage] —
Level MSL 3 (168 Hours) —
Packaging Tray —
Status RoHS [DATA_NEEDED: RoHS compliance status] —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Mounting — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Tipe Memori — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

Spek dan Sumber

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