EP3SE110F1152I4L vs EP3SE110F1152C3N 比較

詳細並排比較 EP3SE110F1152I4L 由 Intel 與 EP3SE110F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ 最後購買機會

規格比較

參數 EP3SE110F1152I4L EP3SE110F1152C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Series Stratix III E Stratix III
Logic Elements 107,500 —
Embedded Memory Bits 8,936,448 bits —
User I/O Count 744 —
Number of LABs/CLBs 4300 —
DSP Multipliers 528 (9-bit equivalent) —
封裝 1152-BBGA, FCBGA —
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +100C (Industrial) 0 °C to 85 °C (commercial)
Speed Grade I4 (fastest industrial grade) C3
Process Technology 40 nm 65 nm TSMC
Supply Voltage (Core) [DATA_NEEDED: nominal core voltage] —
MSL 等級 3 (168 Hours) —
Packaging Tray —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
安裝方式 — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
記憶體類型 — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

資料表與資源

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