EP3SE110F1152I4L vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152I4L sa pamamagitan ng Intel at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F1152I4L EP3SE110F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Series Stratix III E Stratix III
Logic Elements 107,500 —
Embedded Memory Bits 8,936,448 bits —
User I/O Count 744 —
Number of LABs/CLBs 4300 —
DSP Multipliers 528 (9-bit equivalent) —
Packhaging 1152-BBGA, FCBGA —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature na Operasyon -40C to +100C (Industrial) 0 °C to 85 °C (commercial)
Speed Grade I4 (fastest industrial grade) C3
Process Technology 40 nm 65 nm TSMC
Supply Voltage (Core) [DATA_NEEDED: nominal core voltage] —
Level ng MSL 3 (168 Hours) —
Packaging Tray —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Style ng Pagpapasok — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Uri ng Memory — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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