EP3SE110F1152I4L vs EP3SE110F1152C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152I4L disebabkan oleh Intel dan EP3SE110F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C3N EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N - Stratix III E FPGA, 107.5K LE, FC-FBGA-1152 | Intel

EP3SE110F1152C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE110F1152I4L EP3SE110F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Masa Terakhir Dibeli
Series Stratix III E Stratix III
Logic Elements 107,500 —
Embedded Memory Bits 8,936,448 bits —
User I/O Count 744 —
Number of LABs/CLBs 4300 —
DSP Multipliers 528 (9-bit equivalent) —
Kemasan 1152-BBGA, FCBGA —
Jenis Pemasangan Surface Mount Surface Mount
Suhu Operasi -40C to +100C (Industrial) 0 °C to 85 °C (commercial)
Speed Grade I4 (fastest industrial grade) C3
Process Technology 40 nm 65 nm TSMC
Supply Voltage (Core) [DATA_NEEDED: nominal core voltage] —
Aras MSL 3 (168 Hours) —
Packaging Tray —
Status RoHS [DATA_NEEDED: RoHS compliance status] —
Family — Stratix III E
Logic Elements (LE) — 107,500
Logic Array Blocks (LABs) — 4,300
Total RAM Bits — 8,936,448
User I/Os — 744
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Gaya Pemasangan — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Jenis Ingatan — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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