EP3SE260F1152C2 vs EP3SE110F1152C4 Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C2 dari Intel dan EP3SE110F1152C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C2 EP3SE110F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Waktu Pembelian Terakhir
Manufacturer Intel (formerly Altera) —
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 [DATA_NEEDED: LAB count]
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Paket 1152-ball FC-FBGA (Flip Chip) —
Tipe Mounting Surface Mount —
Speed Grade C2 (commercial) —
Suhu Kerja Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] —
Status RoHS Compliant Compliant
Lead-Free Yes —
Level MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

Spek dan Sumber

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