EP3SE260F1152C2 vs EP3SE110F1152C4 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C2 disebabkan oleh Intel dan EP3SE110F1152C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SE260F1152C2 EP3SE110F1152C4
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Manufacturer Intel (formerly Altera) —
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 [DATA_NEEDED: LAB count]
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
Kemasan 1152-ball FC-FBGA (Flip Chip) —
Jenis Pemasangan Surface Mount —
Speed Grade C2 (commercial) —
Suhu Operasi Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] —
Status RoHS Compliant Compliant
Lead-Free Yes —
Aras MSL [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

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