EP3SE260F1152C2 vs EP3SE110F1152C4 比較

詳細並排比較 EP3SE260F1152C2 由 Intel 與 EP3SE110F1152C4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE110F1152C4 EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel

EP3SE110F1152C4 ⚠ 最後購買機會

規格比較

參數 EP3SE260F1152C2 EP3SE110F1152C4
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Manufacturer Intel (formerly Altera) —
Series Stratix® III E —
Logic Elements (LE) 255,000 —
Logic Array Blocks (LABs) 10,200 [DATA_NEEDED: LAB count]
Embedded Memory (bits) 16,672,768 —
User I/Os 744 —
User I/O Banks [DATA_NEEDED: I/O bank count] —
Core Voltage (VCCINT) 1.1 V —
Process Technology 65 nm CMOS 65 nm
封裝 1152-ball FC-FBGA (Flip Chip) —
安裝類型 Surface Mount —
Speed Grade C2 (commercial) —
工作溫度 Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] —
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
MSL 等級 [DATA_NEEDED: MSL rating] —
Design Software Quartus II (Stratix III support) —
Family — Stratix III E
Logic Elements — 107,500
Embedded Memory — 8,936,448 bits
Maximum User I/Os — 744
DSP Blocks — [DATA_NEEDED: 18x18 multiplier count]
Core Voltage — 1.1 V
Maximum Performance — 450 MHz
Package Type — 1152-ball FCBGA (Flip-Chip BGA)
Operating Temperature Grade — Commercial (C4)
Configuration Memory — SRAM-based (volatile)
On-chip Termination — Dynamic, programmable
I/O Standards Supported — LVDS, LVTTL, LVCMOS, HSTL, SSTL

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