EP3SE260F1152C2G vs EP3SE260F1152C4N Perbandingan

Perbandingan bersamaan detil EP3SE260F1152C2G dari Altera dan EP3SE260F1152C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152C2G EP3SE260F1152C4N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Obsolete
Family Stratix III E Stratix III (Enhanced)
Series EP3SE260 Stratix III E
Logic Elements / Cells 255000 —
Total RAM Bits 16672768 —
Number of LABs / CLBs 10200 —
Number of I/O 744 —
Number of Terminals 1152 —
Paket 1152-BBGA, FCBGA (FineLine BGA) 1152-ball FC-FBGA (flip-chip)
Package Code BGA (Ball Grid Array) —
Package Shape Square —
Technology / Process Node 65 nm —
Core Voltage 1.1 V 1.1 V
Speed Grade C2 (commercial) -4 (commercial temperature)
Lead-Free (RoHS) Yes (G suffix) —
Operating Temperature Grade Commercial (C) —
Tipe Mounting Surface Mount Surface Mount (BGA)
Supply Packaging Tray —
Status RoHS Compliant (G suffix) —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Process Technology — 65 nm CMOS
Maximum Operating Frequency — 450 MHz
Suhu Kerja — 0C to +85C (commercial, 'C' suffix)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Tipe Memori — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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