EP3SE260F1152C2G vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2G sa pamamagitan ng Altera at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C2G EP3SE260F1152C4N
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family Stratix III E Stratix III (Enhanced)
Series EP3SE260 Stratix III E
Logic Elements / Cells 255000 —
Total RAM Bits 16672768 —
Number of LABs / CLBs 10200 —
Number of I/O 744 —
Number of Terminals 1152 —
Packhaging 1152-BBGA, FCBGA (FineLine BGA) 1152-ball FC-FBGA (flip-chip)
Package Code BGA (Ball Grid Array) —
Package Shape Square —
Technology / Process Node 65 nm —
Core Voltage 1.1 V 1.1 V
Speed Grade C2 (commercial) -4 (commercial temperature)
Lead-Free (RoHS) Yes (G suffix) —
Operating Temperature Grade Commercial (C) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Supply Packaging Tray —
Tindminan RoHS Compliant (G suffix) —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Process Technology — 65 nm CMOS
Maximum Operating Frequency — 450 MHz
Temperature na Operasyon — 0C to +85C (commercial, 'C' suffix)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita