EP3SE260F1152C3N vs EP3SE260F1152I3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C3N dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C3N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Logic Elements / Cells | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 744 | 744 |
| Paket | 1152-BBGA, FCBGA | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Kerja | 0 C to +85 C (Commercial) | -40C to +100C (Industrial) |
| Transceivers | Integrated high-speed transceivers | — |
| DSP Blocks | Yes (dedicated multiplier/accumulator) | — |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) | — |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Partial Reconfiguration | Supported | — |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |