EP3SE260F1152C3N vs EP3SE260F1152I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152C3N disebabkan oleh Intel dan EP3SE260F1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SE260F1152C3N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Logic Elements / Cells | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 744 | 744 |
| Kemasan | 1152-BBGA, FCBGA | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | 1.1 V |
| Suhu Operasi | 0 C to +85 C (Commercial) | -40C to +100C (Industrial) |
| Transceivers | Integrated high-speed transceivers | — |
| DSP Blocks | Yes (dedicated multiplier/accumulator) | — |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) | — |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Partial Reconfiguration | Supported | — |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |
| Product Status | — | Obsolete (per Xecor comparator) |