EP3SE260F1152C3N vs EP3SE260F1152I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3N sa pamamagitan ng Intel at EP3SE260F1152I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3N EP3SE260F1152I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Obsolete
Series Stratix III E Stratix III E (EP3SE260)
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 744
Packhaging 1152-BBGA, FCBGA 1152-BBGA, FC-FBGA (Flip-Chip)
Uri ng Pagpapasok Surface Mount Surface Mount
Process Technology 65 nm 65 nm
Core Voltage 1.1 V 1.1 V
Temperature na Operasyon 0 C to +85 C (Commercial) -40C to +100C (Industrial)
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Logic Elements — 255,000
Number of LABs/CLBs — 10,200
Total RAM Bits — 16,672,768
Number of Embedded Multipliers (DSP blocks) — 768
Maximum Fabric Frequency — 500 MHz
Speed Grade — I3 (Industrial, speed bin 3)
Level ng MSL — [DATA_NEEDED: MSL level]
Product Status — Obsolete (per Xecor comparator)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita