EP3SE260F1152I3G vs EP3SE260F1152C3N Perbandingan

Perbandingan bersamaan detil EP3SE260F1152I3G dari Intel dan EP3SE260F1152C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1152I3G EP3SE260F1152C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits 16,672,768 bits
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 744
Paket 1152-BBGA, FCBGA (FineLine BGA) 1152-BBGA, FCBGA
Rentang Suhu Kerja -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) —
Process Technology 40 nm TSMC low-power 65 nm
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Tipe Mounting Surface Mount (BGA) Surface Mount
Status RoHS [DATA_NEEDED: RoHS compliance not stated in scraped data] Compliant
Tingkat Sensitivitas Kekeringan (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements / Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Core Voltage — 1.1 V
Suhu Kerja — 0 C to +85 C (Commercial)
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

Spek dan Sumber

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