EP3SE260F1152I3G vs EP3SE260F1152C3N 比較
詳細並排比較 EP3SE260F1152I3G 由 Intel 與 EP3SE260F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ 啟用中規格比較
| 參數 | EP3SE260F1152I3G | EP3SE260F1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 啟用中 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | 16,672,768 bits |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | 744 |
| 封裝 | 1152-BBGA, FCBGA (FineLine BGA) | 1152-BBGA, FCBGA |
| 工作溫度範圍 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | — |
| Process Technology | 40 nm TSMC low-power | 65 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance not stated in scraped data] | Compliant |
| 濕度敏感等級 (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements / Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Core Voltage | — | 1.1 V |
| 工作溫度 | — | 0 C to +85 C (Commercial) |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |