EP3SE260F1152I3N vs EP3SE260F1152I3 Perbandingan
Perbandingan bersamaan detil EP3SE260F1152I3N dari Intel dan EP3SE260F1152I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152I3N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Total RAM Bits | 16672768 | 16,672,768 |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 1.1 V |
| Suhu Kerja | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Paket / Case | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Level MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Paket | — | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Product Status | — | Obsolete (per Xecor comparator) |