EP3SE260F1152I3N vs EP3SE260F1152I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I3N disebabkan oleh Intel dan EP3SE260F1152I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1152I3N | EP3SE260F1152I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Series | Stratix III E | Stratix III E (EP3SE260) |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | — |
| Logic Array Blocks (LABs) | 10200 | — |
| Total RAM Bits | 16672768 | 16,672,768 |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 1.1 V |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Aras MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 255,000 |
| Number of LABs/CLBs | — | 10,200 |
| User I/O Count | — | 744 |
| Number of Embedded Multipliers (DSP blocks) | — | 768 |
| Maximum Fabric Frequency | — | 500 MHz |
| Kemasan | — | 1152-BBGA, FC-FBGA (Flip-Chip) |
| Speed Grade | — | I3 (Industrial, speed bin 3) |
| Product Status | — | Obsolete (per Xecor comparator) |