EP3SE260F1152I3N vs EP3SE260F1152I3 比較

詳細並排比較 EP3SE260F1152I3N 由 Intel 與 EP3SE260F1152I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1152I3N EP3SE260F1152I3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Series Stratix III E Stratix III E (EP3SE260)
Family Name Stratix III E —
Logic Elements / Cells 255000 —
Logic Array Blocks (LABs) 10200 —
Total RAM Bits 16672768 16,672,768
Number of I/Os 744 —
Number of Gates [DATA_NEEDED: number of gates] —
Core Voltage 0.9 V to 1.1 V selectable 1.1 V
工作溫度 -40C to +100C (industrial) -40C to +100C (Industrial)
安裝類型 Surface Mount Surface Mount
封裝 / 外殼 1152-BBGA, FCBGA (FC-FBGA) —
Process Technology 65 nm CMOS 65 nm
Max Internal Frequency 500 MHz —
Supplier Temperature Grade Industrial —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Logic Elements — 255,000
Number of LABs/CLBs — 10,200
User I/O Count — 744
Number of Embedded Multipliers (DSP blocks) — 768
Maximum Fabric Frequency — 500 MHz
封裝 — 1152-BBGA, FC-FBGA (Flip-Chip)
Speed Grade — I3 (Industrial, speed bin 3)
Product Status — Obsolete (per Xecor comparator)

資料表與資源

瀏覽所有產品 建立 BOM 索取報價