EP3SE260F1517I3N vs EP3SE260F1517I4L Perbandingan
Perbandingan bersamaan detil EP3SE260F1517I3N dari Intel dan EP3SE260F1517I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE260F1517I3N | EP3SE260F1517I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Family | Stratix® III E | Stratix III Enhanced (E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 976 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Paket | 1517-ball FC-FBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed Grade | -3 (fastest) | I4 |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | Industrial |
| Suhu Hubung Kerja | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | JTAG, Passive Serial, Fast Passive Parallel |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Series | — | Stratix III |
| Embedded Memory | — | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Suhu Kerja | — | -40C to +100C (Industrial) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Level MSL | — | 3 (per JEDEC J-STD-020) |