EP3SE260F1517I3N vs EP3SE260F1517I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I3N disebabkan oleh Intel dan EP3SE260F1517I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE260F1517I3N | EP3SE260F1517I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Aktif |
| Family | Stratix® III E | Stratix III Enhanced (E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 976 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Kemasan | 1517-ball FC-FBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Speed Grade | -3 (fastest) | I4 |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | Industrial |
| Suhu Hubungan Operasi | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | JTAG, Passive Serial, Fast Passive Parallel |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Series | — | Stratix III |
| Embedded Memory | — | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Suhu Operasi | — | -40C to +100C (Industrial) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |