EP3SE260F1517I3N vs EP3SE260F1517I4L 比較

詳細並排比較 EP3SE260F1517I3N 由 Intel 與 EP3SE260F1517I4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1517I3N EP3SE260F1517I4L
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Family Stratix® III E Stratix III Enhanced (E)
Logic Elements 255,000 255,000
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 976 —
Core Voltage 1.1 V —
Process Technology 65 nm 65 nm CMOS
封裝 1517-ball FC-FBGA —
安裝類型 Surface Mount Surface Mount
Speed Grade -3 (fastest) I4
Temperature Grade Industrial (I): -40 °C to +100 °C Industrial
工作接面溫度 -40 °C to +100 °C —
Configuration Method JTAG / Passive Serial / Active Serial JTAG, Passive Serial, Fast Passive Parallel
RoHS 狀態 Compliant Compliant
Lead-Free Yes —
Internal Logic Performance Up to 500 MHz —
Memory Subsystems M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers —
DSP Blocks Yes (dedicated multiply-accumulate) —
Series — Stratix III
Embedded Memory — 16,672,768 bits (16.6 Mbits)
Maximum User I/O — 976
Package Type — 1517-BBGA, FCBGA
Package Dimensions — 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch)
工作溫度 — -40C to +100C (Industrial)
Lead-Free / RoHS — Yes (L suffix)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
DSP Blocks (18x18 Multipliers) — 768
MSL 等級 — 3 (per JEDEC J-STD-020)

資料表與資源

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