EP3SE260F1517I3N vs EP3SE260F1517I4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3N sa pamamagitan ng Intel at EP3SE260F1517I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3N | EP3SE260F1517I4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Aktibo |
| Family | Stratix® III E | Stratix III Enhanced (E) |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 976 | — |
| Core Voltage | 1.1 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Packhaging | 1517-ball FC-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | -3 (fastest) | I4 |
| Temperature Grade | Industrial (I): -40 °C to +100 °C | Industrial |
| Temperature ng Junction na Operasyon | -40 °C to +100 °C | — |
| Configuration Method | JTAG / Passive Serial / Active Serial | JTAG, Passive Serial, Fast Passive Parallel |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Internal Logic Performance | Up to 500 MHz | — |
| Memory Subsystems | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers | — |
| DSP Blocks | Yes (dedicated multiply-accumulate) | — |
| Series | — | Stratix III |
| Embedded Memory | — | 16,672,768 bits (16.6 Mbits) |
| Maximum User I/O | — | 976 |
| Package Type | — | 1517-BBGA, FCBGA |
| Package Dimensions | — | 40 mm x 40 mm (BGA1517, 39x39, 1.0 mm pitch) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Supply Voltage (Core) | — | [DATA_NEEDED: core voltage] |
| DSP Blocks (18x18 Multipliers) | — | 768 |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |