EP3SE260H780C3 vs EP3SE260H780C2N Perbandingan

Perbandingan bersamaan detil EP3SE260H780C3 dari Intel dan EP3SE260H780C2N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260H780C3 EP3SE260H780C2N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Waktu Pembelian Terakhir
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE Stratix III E
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10200 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
User I/Os 488 —
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS —
Speed Grade C3 C2
Suhu Kerja Commercial, 0C to +85C —
Maximum Core Frequency 500 MHz —
Paket 780-ball FCBGA (HBGA), flip-chip 780-BGA FCBGA
Tipe Mounting Surface Mount (BGA) Surface Mount
Tingkat Sensitivitas Kekeringan (MSL) 3 (168 hours) —
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
Status RoHS Compliant (per product listings) [DATA_NEEDED: rohs status]
LABs / CLBs — 10,200
Total RAM Bits — 16,672,768
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
Core Voltage — 0.9 V
Rentang Suhu Kerja — Commercial (0C to +85C)
Level MSL — 3 (168 hours)
Reflow Peak Time Max — 40 s
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780
Process Node — 40 nm

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon